Samsung, AMD sign MoU on AI memory

SEOUL, Mar 18 (Reuters): Samsung Electronics and Advanced Micro Devices signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday.
The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC processors. The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing services for next-generation AMD products.